Prof Jack CHENG

Prof. Jack CHENG is an Associate Head and Professor in the Department of Civil and Environmental Engineering, Associate Director of GREAT Smart Cities Institute, Director of Building Information Modelling (BIM) Lab, and Director of RFID Center at the Hong Kong University of Science and Technology. Prof. CHENG obtained his PhD degree from Stanford University. His research interests include BIM, Internet of Things, artificial intelligence, construction robotics, blockchain, construction and facility management, smart and low carbon buildings, and construction digitalisation. Prof. CHENG has led a number of Research and Development projects in smart buildings and construction. He is an author of over 270 international journal and conference publications.

Prof. CHENG is currently the Chairperson of Task Force on BIM Standards of the Hong Kong Construction Industry Council (CIC), a Council Member and a Member of the BIM Committee of CIC, Honorary Treasurer of the Hong Kong Institute of Building Information Modeling (HKIBIM), and a Director of the Hong Kong Green Building Council.  He is a Past President of the American Society of Civil Engineers Greater China Section and Past Chairman of the Autodesk Industry Advisory Board. Prof. CHENG is a Fellow Member of the Hong Kong Institute of Civil and Building Information Management, Professional Member of the HKIBIM, CIC Certified BIM Manager (CCBM), CIC Certified BIM Coordinator (CCBC), and Certified Carbon Auditor Professional. He has received the Construction Industry Outstanding Person Award in 2019 and Young BIMer of the Year in 2014 from CIC, and a few research and paper awards in international conferences.